High Precision Manual Stencil Printer, Large Printing Area, Heavy Duty

SKU
STP-550
ML-21C Mini Soldering Pot

ML-21C Mini Soldering Pot

Automatic Lead-Free Mini Reflow Oven MD-2012

Automatic Lead-Free Mini Reflow Oven MD-2012

Availability: In stock
$1,580.00

Specifications:

         Working area: 23"x16", frame thickness should be less than 1.5".

         Max. X direction adjustment: 5/8".

         Max. Y direction adjustment: 5/8".

         Max. Z direction adjustment: 5/8".

         θ adjustment 10°.

Heavy duty construction

Open end, fit any framed stencils as long as the paste area is smaller than the base.

         Circuit board mount kit included, capable of two side boards.

         Use framed stencils. Stencil and frame not included. 

         Unit weight:  85 lb


*Squeegee not included, sold seperately.

The printer is pre-assembed.

Operation

1. Mount the stencil by tightening the clamps on the back of the stencil 
printer.

2. Align the PCB with the stencil by using the four L shaped blocks supplied.

3. Fine adjustment is achieved by turning the knobs around the base. Z direction adjustment knob is at the back.
4. Apply a thin layer of solder paste. Too much paste will cause short circuits.

More Information
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