Fast heat up, 10 seconds to reach 250°C.
- Built in temperature sensor for stable temperature control.
- Hot and cool air selection for chip preheating or cooling.
- Used together with a hot air rework station and fixture for BGA and other IC's.
- Power: 460W.
- Temperature: 120°C to 250°C(at nozzle).
- Air volume: 0.18 cubic meter/min.
- Size: 100(W) x60 (H) x170 (D) mm.
- Weight: 1kg
| upc | No |
|---|---|
| length | No |
| width | No |
| height | No |